Integrated chips are made by several transistors and electronic wiring components together to perform functions complejas.tradicionalmente, connections between chip and circuit boards are made of wires that connect to a designated link on a chip pad prefabricated metal.
"Built-in functions require a number of cable connections." Is tedious and time-consuming do and increases the cost, "said min-Feng Yu, a Professor of mechanical science and engineering at Illinois."
In addition, link to traditional cable bonds platform occupies a considerable area of espacio.Como technology has moved toward electronics smaller, reducing wiring has been a major obstacle.A number of microelectronic devices is less than the required 50 per 50 micron square link site, which prohibits the features built into the very small scale.
"There is no existing profitable technology that would allow him to microstructures binding wire," said Yu, "do so we will get rid of these cables and instead, why not directly produce them on-site between connection points?".
Yu Jie Hu graduate student developed a technique directly write tiny wires that produces much smaller diameter pure metals traditional cables and require two orders of magnitude less enlace.En area a document appearing on July 16, scientific editing, shown as a number that 20 of their new cables bonded to a single standard binding site.
"This technique means that pills might be much smaller than what is needed to link traditional cable technology", said Yu. This reduction in the area could allow manufacturers to produce more chips per wafer Semiconductor. It would also allow more complex functions integrated in microelectronics.
The couple has demonstrated his technique with copper and Platinum wires and plans to explore the technique with other metals.
"Yu likens his technique to writing with a fountain pen.""The mentality of people is that he draws a line on a surface, but what we are doing is to write in a 3D space," he said.
The duo had loaded a micropipette - a device that dispenses with small amounts of liquid - with a solution of copper electrolítico.Cuando pipette comes into close contact with the surface, a bridge between scientists, the pipette tip and enlace.Los pad liquid forms then apply an electric current, which makes that the solution to deposit as solid metal copper.As the tip moves through space, copper continues to tank solution in pipette, as the ink pen, creating a cable.Yu and Hu challenge was to calculate the correct speed to move the pipette tip to keep the liquid bridge between the nozzle and the growing wire.
"It is liquid, so it can easily be shaped," said Yu."As long as kept his speed within certain range, will always be able to produce consistent, high quality cables."
Also had to find out how cables laterally to chip-a - chip "write" typical .Micropipeta nozzles links are flat at the end, but too much inclination breaks líquido.El contact duo of Illinois noted a mouthpiece of notches cut 90 degrees on the side, allowed lateral movement, which means that cables can arc from a link site to another, even if the chips are stacked or levels.
The process is automatic, therefore Yu expected develop micropipettes matrices to produce bond wire in bulk for manufacturing more efficient.
"" An advantage is that you can do this in parallel,"said."Rather than a mouthpiece, suppose you have 10, 20 or 100 work of form simultánea.En one-step, can make tens or hundreds of bonds, and that is the cost savings.
Addition of wire bonds, the technique could produce a myriad of metals microstructures for various applications.
"" Capacity for the manufacture of metal structures in 3-d can open a number of other opportunities,"said Yu.""Has many desirable properties apart from the eléctricos.Se can imagine structures that take advantage of the different properties of metal."
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